NEWS

Eurotech CPU-162-23 COM Express Type 7 Basic Module Delivers Intel® Xeon® Performance At The Edge

AMARO (Udine, Italy), May 8th, 2019 Eurotech, a long-time leading provider of embedded computing systems and leader in the Internet of Things (IoT) enablement, announces the availability of its CPU-162-23, a fanless COM Express module designed to deliver supercomputing processing and data center-grade performance at the Edge and in rugged embedded systems.

The CPU-162-23 is a COM Express Type 7 module with a Basic form factor (125x95mm). It combines the power of the Intel® Xeon®/Pentium® D-1500 processor family – up to 16 cores - with up to 4x DDR4 SO-DIMM modules for a total capacity of 64GB of RAM with ECC to bring server-class performance to the Field.

In addition, the module delivers many high-speed interfaces for extreme expandability and networking capabilities: up to x32 PCI Express lanes, 2x 10Gbps and 1x 10/100/1000Mbps Ethernet ports. Other interfaces include 2x SATA 3.0, 4x USB 3.0 and 4x USB 2.0.

Its rugged and fanless design makes it ideal for a variety of Industrial and Transportation applications: it ensures reliable performance in an extended operating temperature range (-40 to +85°C); the soldered-down CPUs and ECC memory further increase reliability in demanding applications.

The CPU-162-23 is a versatile building block for very powerful stand-alone and connected IoT Edge nodes for Cloud computing: it provides full integration with Eurotech IoT Edge Framework Everyware Software Framework (ESF), providing native connectivity with many IoT Cloud services. Among them, Everyware Cloud (EC – separately available), Eurotech IoT Integration Platform, allows remote device and data management and integration with analytics and IT applications.

“The CPU-162-23 enables unprecedented computing performance for a wide range of applications in the Field” stated Giuseppe Surace, Eurotech CP&MO. “It enables the creation of powerful Edge nodes that perform their functions close to the end user to greatly improve latency and bandwidth in high-end applications”.

The CPU-162-23 will be available from Q3 2019. 

CPU-162-23
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