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CPU-163-16

Rugged Fanless COM Express Mini Type 10 - Intel Atom E3900 Series

The CPU-163-16 is a power efficient, fanless and rugged COM Express Mini module that supports the Intel Atom E3900 series CPU. It is ideal for use cases that require reliable operation in harsh conditions and long-term availability.

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Features

Powerful - Powered by Intel Atom E39xx CPU: two and four core configurations, up to 1.6GHz (2.0GHz burst)
Rugged - Supporting wide operating temperature (-40 to +85°C), conformal coating options, soldered CPU, ECC RAM and flash storage
Small - Compliant with PICMG COM Express R2.1, with a 84x55mm (Mini) form factor and a Type 10 pinout
Low Power - Enabling fanless designs with a CPU TDP starting from 6W
IoT Support - Core support for IoT, including IoT middleware and access to Eurotech IoT Integration Platform
Professional Services - Cuts Time-To-Market with Eurotech Design Services, which include deep module customization, BIOS personalization, carrier board and system design and production

Description

The CPU-163-16 is a rugged COM Express module designed to meet the requirements for Industrial, Transportation and Defense rugged fanless applications.

Compliant with PICMG COM Express® R2.1, Type 10, the CPU-163-16 is a Mini (84x55mm) form factor module based on the Intel Atom E3900 processor family with 2 and 4 cores, up to 8GB ECC RAM and up to 64GB eMMC.

Other features include high speed interfaces: one Gbit Ethernet, two SATA 3.0, two USB 3.0 and eight USB 2.0, four PCIe x1 Gen 3, one LVDS and one DDI (supporting HDMI, DVI and DP).

The CPU-163-16 features soldered down ECC memory and flash storage, making it the ideal hardware platform for applications requiring long life cycle, resistance to vibration and reliable data retention, even in extended temperature.

Supported Operating Systems include Linux and Windows 10 IoT Enterprise. The CPU-163-16 is also an ideal building block for IoT projects, supporting core Everyware Software Framework (ESF) capabilities. ESF is a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/OSGi middleware for IoT gateways. Full porting of ESF on the customer carrier is available as a Professional Service.

Distributed and supported by Eurotech, ESF delivers ready-to-use Field protocols (including Modbus, OPC-UA, S7), MQTT connectivity, web-based visual data flow programming and deep configuration. ESF is also integrated with Everyware Cloud (EC), Eurotech IoT Integration Platform (separately available), enabling advanced diagnostics, provisioning, and full remote device access and management.

Professional Services are available for the CPU-163-16, starting from BIOS personalization and including carrier board design, system development and production. Deep module customization, such as feature changes are also available to select customers.

Ordering code: CPU-163-16-XX
XX -01 -02 -03 -04 -05 -06
PROCESSOR CPU Intel Atom x5-E3930 1.30/1.80GHz, 2 Core Intel Atom x5-E3940 1.60/1.80GHz, 4 Cores Intel Atom x7-E3950 1.60/2.00GHz, 4 Cores
BIOS Type AMI BIOS
Size 128Mbit SPI BIOS (UEFI Boot Only)
MEMORY RAM 4GB 1600MHz DDR3L 8GB 1600MHz DDR3L 4GB 1600MHz DDR3L 8GB 1600MHz DDR3L 8GB 1600MHz DDR3L 8GB 1600MHz DDR3L
ECC No Yes No Yes
STORAGE Embedded Storage 16GB eMMC 32GB eMMC 16GB eMMC 32GB eMMC 64GB eMMC
SATA 2x SATA 3.0
I/O INTERFACES Ethernet 1x 10/100/1000Mbps
USB 2x USB 3.0, 8x USB 2.0
Serial 2x Serial (TX/RX)
Digital IO Standard Configuration: 1x SDIO (Factory Option: 8x GPIO)
Video Dual Display: DDI + LVDS or DDI + sDP; 1x DDI (HDMI, DVI, DP); 1x LVDS/eDP; HDMI/DVI: Resolution up to 3840x2160@30Hz; DP++: Resolution up to 4096x2160@60Hz; eDP++: Resolution up to 3840x2160@60Hz; LVDS: 24bit, Single Channel, Resolution up to 1366x768@60Hz; Hardware Decode: HEVC/H.265, VP8, VP9, MVC, AVC/H.264, MPEG2, VC1, WMV9, JPEG/MJPEG; Hardware Encode: HEVC/H.265, VP8, VP9, MVC, AVC/H.264, JPEG/MJPEG; Support for: OpenGL, DirectX, OpenCL
Audio High Definition Audio Interface
PCI Express 4x (PCIe x1 Gen 2)
LPC Yes
I2C Yes
SPI Yes
SMBus Yes
OTHER RTC Yes
Watchdog Software Programmable (From 1 to 255s)
TPM No
Conformal Coating Factory Option
POWER Power Input 4.75V~20V, 5VSB, VCC_RTC (ATX Mode); 4.75V~20V, VCC_RTC (AT Mode)
Power Consumption 6.5W CPU TDP 9.5W CPU TDP 12W CPU TDP
ENVIRONMENT Operating Temperature - 40 to + 85°C
Storage Temperature - 40 to +85°C
Humidity 5% to 90%RH
CERTIFICATIONS Compliance PICMG COM Express® R2.1, Type 10
Environmental RoHS3
MECHANICAL Dimensions COM Express Mini 84mm (3.30") x 55mm (2.16")
Software
SOFTWARE OS Eurotech Everyware Linux; Windows 10 IoT Enterprise 64bit; Carrier support and Porting: Professional Service
IoT Framework Professional service: Everyware Software Framework (Java/OSGi)

Download

CPU-163-16 Datasheet
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Highlights

  • • Powerful
  • • Rugged
  • • Small
  • • Low Power
  • • Fanless
  • • IoT Support
  • • Professional Services
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