• FEATURES
  • SPECIFICATIONS
  • DOWNLOAD

CPU-161-18

COM Express Compact Type 6 - Rugged Intel Xeon D

The CPU-161-18 is a rugged COM Express module that combines a high performance embedded CPU with an innovative hybrid RAM architecture that offers the ruggedness of soldered memory and the expandability of SO-DIMMs.

Download datasheet download

Choose a format

A4 letter

Features

HPEC and Microserver Ready - Combines computational power with a rugged design to enable High Performance applications even in-the-field
Powerful - Supports the latest generation of embedded Intel Pentium and Xeon D-1500 CPUs to deliver a server-class module
Hybrid RAM Architecture - Innovates by offering the reliability of soldered-down RAM and the expandability of SO-DIMMs
Compact Size with PCIe x16 Port - Complies with COM Express Type 6 Rev 2.1, including support for a PCIe x16 port
Rugged and Fanless - Allows robust, fanless designs thanks to 100% soldered-down components and with a range of energy efficient CPUs
Customizable - Comes with optional personalization and full customization services, ranging from factory options to deep HW/SW configuration changes
Professional Services - Provides the foundation for Eurotech Professional Services that span from carrier board development to complete system design, certification and manufacturing

Description

The CPU-161-18 is a COM Express module that combines a high performance and truly embedded CPU with an innovative hybrid RAM architecture that offers the ruggedness of soldered memory and the expandability of SO-DIMMs. The standard configuration provides 8GB of memory soldered directly on the PCB and supports up to 24GB DDR4 RAM with ECC error correction through a SO-DIMM slot, targeting use cases where extreme ruggedness is required, and those that need a large memory.
The CPU-161-18 can be configured with any member of the Xeon/Pentium D-1500 family; standard versions support extended temperature CPUs, such as the Pentium D-1519 and the Xeon D-1559, closing the gap between traditional embedded applications and servers.
Compatible with existing Type 6 carrier boards, the CPU-161-18 is a headless unit that provides a fast upgrade path to existing projects and that allows the creation of new high-performance ones: a notable feature of this Compact size module is the availability of a x16 PCIe Gen 3 port in addition to the x8 one, a characteristic that is more commonly found only on larger modules; other features include: Gigabit Ethernet, four SATA 3.0 ports, four USB 3.0 and seven USB 2.0 interfaces.
Supported operating systems include Yocto Linux and CentOS; moreover, the CPU-161-18 supports Everyware Software Framework (ESF), a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/OSGi middleware for IoT gateways.
Professional Services are available for the CPU-161-18, starting from BIOS personalization and including carrier board design, system development and production. Deep module customization, such as feature changes are also available.

Ordering code: CPU-161-18-XX
XX -05 -06 -07 -08
PROCESSOR CPU Pentium D1519 1.50GHz, 4 Cores Xeon D-1529 1.30GHz, 4 Cores (IEC 61508 Safety Integrity Compliant) Xeon D-1539 1.60GHz, 8 Cores Xeon D-1559 1.50GHz, 12 Cores
MEMORY On-board 8GB DDR4 ECC Memory Down (2133-2400MT/s)
On-socket 1x DDR4 ECC SODIMM up to 16GB
STORAGE Embedded 2x SPI-Flash (16MB + 32MB), 1x EEPROM (8kB)
SATA 4x SATA 3.0 (up to 6Gb/s) 2x SATA 3.0 (up to 6Gb/s) 4x SATA 3.0 (up to 6Gb/s)
RAID Factory Option
I/O INTERFACES Ethernet 1x 10/100/1000Mbps
USB 4x USB 3.0, 7x USB 2.0 (EHCI Supported) 7x USB 2.0 (EHCI Supported) 4x USB 3.0, 7x USB 2.0 (EHCI Supported)
Serial 2x UART (TX/RX)
Digital I/O 1x 8bit Digital I/O
PCI Express 1x PCIe x16 (Gen 3), 4x PCIe x1 (Gen 2), 1x PCIe x4 (Gen 2) – Non-transparent bridge or Transparent bridge (Switchable) 1x PCIe x16 (Gen 2) – Non-transparent bridge or Transparent bridge (Switchable) 1x PCIe x16 (Gen 3), 4x PCIe x1 (Gen 2), 1x PCIe x4 (Gen 2) – Non-transparent bridge or Transparent bridge (Switchable)
LPC Yes
I2C Yes
SMBus Yes
OTHER RTC Yes
Watchdog Yes
Security Intel AES-NI, Intel Secure Key
Sensors Temperature Sensor
POWER Input 12V, 5VSBY, 3V_RTC
Consumption 25W (CPU TDP) 20W (CPU TDP) 35W (CPU TDP) 45W (CPU TDP)
ENVIRONMENT Operating Temp - 40 to +85°C
Storage Temp - 40 to +85°C
Humidity 35% to 85%
CERTIFICATIONS Environmental RoHS (2011/65/EU)
Compliance PICMG COM Express R2.1, Type 6
MECHANICAL Dimensions 95x95mm (LxW) - COM Express Compact
Supported Software
SOFTWARE OS Eurotech Everyware Linux, CentOS 7 (Professional Services: Windows 10 IoT Enterprise, Fedora, Other Linux and RTOS)
IoT Framework Everyware Software Framework (Java/OSGi)

Download

CPU-161-18 Datasheet
PDF download

Choose a format

A4 letter
mail
request information
* required fields
I have read and understood the Privacy Policy *
I agree to receive marketing emails * - read
We would love to share with you our marketing communications. Keep updated on Eurotech latest products, events and newsletter giving us your consent to receive marketing e-mails. If you want to know more about how we manage your data and how to update your subscription preferences, take a look at our Personal Data Use Informative
To confirm click on “SEND”. Click on “RESET” to start over

Highlights

  • • HPEC and Microserver Ready
  • • Intel® Xeon® D-1500
  • • Hybrid RAM Architecture
  • • Compact Size with PCIe x16
  • • Rugged and Fanless
  • • Customizable
  • • Professional Services
This website or third-party tools used in it uses cookies useful for the proper functioning of the site and for the purposes described in the cookie policy. If you want to learn more or opt out of all or some cookies, see the
cookie policy
By closing this banner, scrolling this page, clicking on a link or continuing navigation in any other way, you allow the use of cookies.
agree