The CPU-161-18 is a rugged COM Express module that combines a high performance embedded CPU with an innovative hybrid RAM architecture that offers the ruggedness of soldered memory and the expandability of SO-DIMMs.
The CPU-161-18 is a COM Express module that combines a high performance and truly embedded CPU with an innovative hybrid RAM architecture that offers the ruggedness of soldered memory and the expandability of SO-DIMMs. The standard configuration provides 8GB of memory soldered directly on the PCB and supports up to 24GB DDR4 RAM with ECC error correction through a SO-DIMM slot, targeting use cases where extreme ruggedness is required, and those that need a large memory.
The CPU-161-18 can be configured with any member of the Xeon/Pentium D-1500 family; standard versions support extended temperature CPUs, such as the Pentium D-1519 and the Xeon D-1559, closing the gap between traditional embedded applications and servers.
Compatible with existing Type 6 carrier boards, the CPU-161-18 is a headless unit that provides a fast upgrade path to existing projects and that allows the creation of new high-performance ones: a notable feature of this Compact size module is the availability of a x16 PCIe Gen 3 port in addition to the x8 one, a characteristic that is more commonly found only on larger modules; other features include: Gigabit Ethernet, four SATA 3.0 ports, four USB 3.0 and seven USB 2.0 interfaces.
Supported operating systems include Yocto Linux and CentOS; moreover, the CPU-161-18 supports Everyware Software Framework (ESF), a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/OSGi middleware for IoT gateways.
Professional Services are available for the CPU-161-18, starting from BIOS personalization and including carrier board design, system development and production. Deep module customization, such as feature changes are also available.
|Ordering code: CPU-161-18-XX|
|PROCESSOR||CPU||Pentium D1519 1.50GHz, 4 Cores||Xeon D-1529 1.30GHz, 4 Cores (IEC 61508 Safety Integrity Compliant)||Xeon D-1539 1.60GHz, 8 Cores||Xeon D-1559 1.50GHz, 12 Cores|
|MEMORY||On-board||8GB DDR4 ECC Memory Down (2133-2400MT/s)|
|On-socket||1x DDR4 ECC SODIMM up to 16GB|
|STORAGE||Embedded||2x SPI-Flash (16MB + 32MB), 1x EEPROM (8kB)|
|SATA||4x SATA 3.0 (up to 6Gb/s)||2x SATA 3.0 (up to 6Gb/s)||4x SATA 3.0 (up to 6Gb/s)|
|I/O INTERFACES||Ethernet||1x 10/100/1000Mbps|
|USB||4x USB 3.0, 7x USB 2.0 (EHCI Supported)||7x USB 2.0 (EHCI Supported)||4x USB 3.0, 7x USB 2.0 (EHCI Supported)|
|Serial||2x UART (TX/RX)|
|Digital I/O||1x 8bit Digital I/O|
|PCI Express||1x PCIe x16 (Gen 3), 4x PCIe x1 (Gen 2), 1x PCIe x4 (Gen 2) – Non-transparent bridge or Transparent bridge (Switchable)||1x PCIe x16 (Gen 2) – Non-transparent bridge or Transparent bridge (Switchable)||1x PCIe x16 (Gen 3), 4x PCIe x1 (Gen 2), 1x PCIe x4 (Gen 2) – Non-transparent bridge or Transparent bridge (Switchable)|
|Security||Intel AES-NI, Intel Secure Key|
|POWER||Input||12V, 5VSBY, 3V_RTC|
|Consumption||25W (CPU TDP)||20W (CPU TDP)||35W (CPU TDP)||45W (CPU TDP)|
|ENVIRONMENT||Operating Temp||- 40 to +85°C|
|Storage Temp||- 40 to +85°C|
|Humidity||35% to 85%|
|Compliance||PICMG COM Express R2.1, Type 6|
|MECHANICAL||Dimensions||95x95mm (LxW) - COM Express Compact|
|SOFTWARE||OS||Yocto Linux, CentOS 7 (Professional Services: Windows 10 IoT Enterprise, Fedora, Other Linux and RTOS)|
|IoT Framework||Everyware Software Framework (Java/OSGi)|