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CPU-161-18

COM Express Compact Type 6 - Rugged Intel Xeon D

The CPU-161-18 is a rugged COM Express module that combines a high performance embedded CPU with an innovative hybrid RAM architecture that offers the ruggedness of soldered memory and the expandability of SO-DIMMs.

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Features

HPEC and Microserver Ready - Combines computational power with a rugged design to enable High Performance applications even in-the-field
Powerful - Supports the latest generation of embedded Intel Pentium and Xeon D-1500 CPUs to deliver a server-class module
Hybrid RAM Architecture - Innovates by offering the reliability of soldered-down RAM and the expandability of SO-DIMMs
Compact Size with PCIe x16 Port - Complies with COM Express Type 6 Rev 2.1, including support for a PCIe x16 port
Rugged and Fanless - Allows robust, fanless designs thanks to 100% soldered-down components and with a range of energy efficient CPUs
Customizable - Comes with optional personalization and full customization services, ranging from factory options to deep HW/SW configuration changes
Professional Services - Provides the foundation for Eurotech Professional Services that span from carrier board development to complete system design, certification and manufacturing

Description

The CPU-161-18 is a COM Express module that combines a high performance and truly embedded CPU with an innovative hybrid RAM architecture that offers the ruggedness of soldered memory and the expandability of SO-DIMMs. The standard configuration provides 8GB of memory soldered directly on the PCB and supports up to 24GB DDR4 RAM with ECC error correction through a SO-DIMM slot, targeting use cases where extreme ruggedness is required, and those that need a large memory.
The CPU-161-18 can be configured with any member of the Xeon/Pentium D-1500 family; standard versions support extended temperature CPUs, such as the Pentium D-1519 and the Xeon D-1559, closing the gap between traditional embedded applications and servers.
Compatible with existing Type 6 carrier boards, the CPU-161-18 is a headless unit that provides a fast upgrade path to existing projects and that allows the creation of new high-performance ones: a notable feature of this Compact size module is the availability of a x16 PCIe Gen 3 port in addition to the x8 one, a characteristic that is more commonly found only on larger modules; other features include: Gigabit Ethernet, four SATA 3.0 ports, four USB 3.0 and seven USB 2.0 interfaces.
Supported operating systems include Yocto Linux and CentOS; moreover, the CPU-161-18 supports Everyware Software Framework (ESF), a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/OSGi middleware for IoT gateways.
Professional Services are available for the CPU-161-18, starting from BIOS personalization and including carrier board design, system development and production. Deep module customization, such as feature changes are also available.

Ordering code: CPU-161-18-XX
XX -05 -06 -07 -08
PROCESSOR CPU Pentium D1519 1.50GHz, 4 Cores Xeon D-1529 1.30GHz, 4 Cores (IEC 61508 Safety Integrity Compliant) Xeon D-1539 1.60GHz, 8 Cores Xeon D-1559 1.50GHz, 12 Cores
MEMORY On-board 8GB DDR4 ECC Memory Down (2133-2400MT/s)
On-socket 1x DDR4 ECC SODIMM up to 16GB
STORAGE Embedded 2x SPI-Flash (16MB + 32MB), 1x EEPROM (8kB)
SATA 4x SATA 3.0 (up to 6Gb/s) 2x SATA 3.0 (up to 6Gb/s) 4x SATA 3.0 (up to 6Gb/s)
RAID Factory Option
I/O INTERFACES Ethernet 1x 10/100/1000Mbps
USB 4x USB 3.0, 7x USB 2.0 (EHCI Supported) 7x USB 2.0 (EHCI Supported) 4x USB 3.0, 7x USB 2.0 (EHCI Supported)
Serial 2x UART (TX/RX)
Digital I/O 1x 8bit Digital I/O
PCI Express 1x PCIe x16 (Gen 3), 4x PCIe x1 (Gen 2), 1x PCIe x4 (Gen 2) – Non-transparent bridge or Transparent bridge (Switchable) 1x PCIe x16 (Gen 2) – Non-transparent bridge or Transparent bridge (Switchable) 1x PCIe x16 (Gen 3), 4x PCIe x1 (Gen 2), 1x PCIe x4 (Gen 2) – Non-transparent bridge or Transparent bridge (Switchable)
LPC Yes
I2C Yes
SMBus Yes
OTHER RTC Yes
Watchdog Yes
Security Intel AES-NI, Intel Secure Key
Sensors Temperature Sensor
POWER Input 12V, 5VSBY, 3V_RTC
Consumption 25W (CPU TDP) 20W (CPU TDP) 35W (CPU TDP) 45W (CPU TDP)
ENVIRONMENT Operating Temp - 40 to +85°C
Storage Temp - 40 to +85°C
Humidity 35% to 85%
CERTIFICATIONS Environmental RoHS (2011/65/EU)
Compliance PICMG COM Express R2.1, Type 6
MECHANICAL Dimensions 95x95mm (LxW) - COM Express Compact
Supported Software
SOFTWARE OS Yocto Linux, CentOS 7 (Professional Services: Windows 10 IoT Enterprise, Fedora, Other Linux and RTOS)
IoT Framework Everyware Software Framework (Java/OSGi)

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CPU-161-18 Datasheet
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Highlights

  • • HPEC and Microserver Ready
  • • Intel® Xeon® D-1500
  • • Hybrid RAM Architecture
  • • Compact Size with PCIe x16
  • • Rugged and Fanless
  • • Customizable
  • • Professional Services
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