The CPU-161-19 is a COM Express module that features the Intel Atom x6000 Series.
The CPU-161-19 is a COM Express module that features the Intel Atom x6000 Series. It comes in two variants: one is 100% COM Express Type 6 compliant and the other has proprietary extensions. The proprietary extensions provide additional features and are mapped on unused pins and deliver a range of novel interfaces that can greatly simplify the design of the carrier board and reduce its cost. Designed for fanless applications in harsh environments where long term reliability is a must, the CPU-161-19 delivers up to 4 CPU cores and 32 GPU execution units and in-band ECC RAM. If features an all-soldered down design to improve resilience and thermal coupling, and comes with a -40 to +85°C operating temperature.
Both the CPU and the integrated GPU deliver great performance improvements compared to the previous Atom generation, with a speed up that is up to 40% for traditional computing and up to 2x for graphics acceleration, while keeping the TDP at 12W or less.The CPU-161-19 fully exploits a new capability of the Atom x6000 series: an embedded ARM core provides an independent engine that manages a large number of native industrial interfaces, including Ethernet ports, ADCs, Quadrature Encoders, GPIOs, UARTs and CAN-FD.
The combination of the independent engine with Time Sensitive Networking (TSN) and Time Coordinated Computing (TCC) enables soft Real Time applications. TSN is an evolution of the Ethernet standard that provides time determinism to networked communications, while staying completely compatible with the exisiting Ethernet infrastructures. TCC bridges the sinchronization of the internal clocks with the network to achieve microsecond accuracy.
Supported operating systems include Everyware Linux (based on Yocto) and Windows 10 IoT Enterprise; additionally, the CPU-161-19 supports Everyware Software Framework (ESF), a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/OSGi middleware for IoT gateways.Professional Services are available for the CPU-161-19, starting from BIOS personalization and including carrier board design, system development and production. Deep module customization, such as feature changes are also available.
|Ordering code: CPU-161-19-XX|
|PROCESSOR||CPU||Atom x6212RE 1.20GHz, 2 Cores||Atom x6414RE 1.50GHz, 4 Cores||Atom x6425RE 1.90GHz, 4 Cores||Atom x6212RE 1.20GHz, 2 Cores||Atom x6414RE 1.50GHz, 4 Cores||Atom x6425RE 1.90GHz, 4 Cores|
|GPU||Type||Integrated, 11th Generation|
|MEMORY||RAM||4GB DDR4 IBECC, 3200MT/s, Soldered Down||8GB DDR4 IBECC, 3200MT/s, Soldered Down||16GB DDR4 IBECC, 3200MT/s, Soldered Down||4GB DDR4 IBECC, 3200MT/s, Soldered Down||8GB DDR4 IBECC, 3200MT/s, Soldered Down||16GB DDR4 IBECC, 3200MT/s, Soldered Down|
|STORAGE||Embedded||1x SPI-Flash - 1x EEPROM|
|SATA||2x SATA 3.0 (up to 6Gb/s)|
|SD||1x SDXC (Factory Option)|
|MULTIMEDIA||Video Ports||2x DDI (HDMI/DVI/DP++), 1x LVDS/eDP (eDP Factory Option), 1x VGA (Factory Option), Triple Display: VGA+DDI1+DDI2 or LVDS+DDI1+DDI2 or eDP+DDI1+DDI2|
|Video Resolution||DDI1 and DD2: 4Kp60 / VGA: 1920x1200@60Hz / LVDS: 1920x1200@60Hz, Dual Channel, 24bit|
|Video Acceleration||HW Encode: HEVC/H.265, H.264/AVC, VP9, M/JPEG; HW Decode: HEVC/H.265, H.264/AVC, VP8, VP9, VC1, M/JPEG, MPEG2|
|Audio||HDA Interface / Speaker||HDA Interface / Speaker / I2S / DMIC|
|I/O INTERFACES||Ethernet||1x 10/100/1000/2500Mbps with TSN||1x 10/100/1000/2500Mbps with TSN 2x SGMII 10/100/1000/2500Mbps (Factory Option)|
|USB||2x USB 3.0 / 8x USB 2.0|
|Serial||2x UART (TX/RX)||3x UART 2-wire, 5x UART 4-wire|
|CANBus||1x CAN-FD (Factory Option)||2x CAN-FD|
|Digital I/O||4x GPI / 4x GPO (or SDXC)||5x GPI / 4x GPO / 3x GPIO or 1x GPI / 3x GPIO / SDXC (Factory Option)|
|Other Industrial||Not Available||6x ADC, 2x Quadrature Encoder|
|PCI Express||1x PCIe x4 Gen3 (or 2x PCIe x2 Gen3, or 4x PCIe x1 Gen3) 2x PCIe x1 Gen3 (Mutually Exclusive with SGMII)|
|System Bus||1x LPC / 1x I2C / 1x SPI / 1x SMBus||1x LPC / 2x I2C / 3x SPI / 1x SMBus|
|TPM||TPM 2.0 (Discrete Chip)|
|POWER||Input||12V, 5VSBY, 3V_RTC (ATX Mode) / 12V, VCC_RTC (AT Mode)|
|Consumption||6W (CPU TDP)||9W (CPU TDP)||12W (CPU TDP)||6W (CPU TDP)||9W (CPU TDP)||12W (CPU TDP)|
|ENVIRONMENT||Operating Temp||-40 to +85°C|
|Storage Temp||-40 to +85°C|
|Humidity||5% to 90% RH|
|CERTIFICATIONS||Regulatory||CE, FCC, ISED|
|Safety||EN 62368, UL 60950|
|Compliance||PICMG COM Express R3.0, Type 6||Based on PICMG COM Express R3.0, Type 6, with Proprietary Extensions|
|MECHANICAL||Dimensions||95x95mm (LxW) - COM Express Compact|
|SOFTWARE||OS||Everyware Linux, Windows 10 IoT Enterprise (Professional Services: Other Linux and RTOS)|
|IoT Framework||Everyware Software Framework (Java/OSGi)|