Eurotech: Parvus Unveils DuraHPC 5-1 Rugged High Performance Embedded Computer for Tactical Applications

Liquid Cooled DuraHPC 5-1 Delivers Up to 167 GFlops Computational Performance in Rugged 1U Chassis

Amaro (ITALY) and Tampa, FL, 11 July, 2012 Eurotech subsidiary Parvus announces the DuraHPC 5-1, a field-deployable, rugged High Performance Embedded Computer (HPEC) designed for computationally intensive processing requirements in extreme military, aerospace, and industrial applications. Delivering up to 167 GFlops of performance, the DuraHPC 5-1 features high- performance multi-core Intel Xeon server-class processors, an optional integrated liquid cooling subsystem, and a shock/vibration-resistant solid state disk (SSD). Parvus will be displaying the DuraHPC 5-1 at booth #1119 of the AFCEA TechNet Land Forces South 2012 held in the Tampa Convention Center.

Leveraging the underlying high performance computing (HPC) blade architecture of the Aurora supercomputer but in a ruggedized and tightly integrated liquid-cooled chassis, the DuraHPC 5-1 is designed for data intensive tactical applications, including Intelligence, Surveillance, Reconnaissance (ISR), Digital Signal Processing (DSP), simulation/training, energy exploration, situational awareness, vehicle electronics and radar signal processing. All system processors are linked via Intels high bandwidth Quick Path Interconnect (QPI) with three channels of DDR3 memory connected to each CPU. Each unit features low-latency Infiniband interconnectivity (or optional 10 Gigabit Ethernet) to support rugged parallel computing capabilities when more than one unit is connected together in a cluster.

Fitted with an ingress-protected aluminum chassis, hermetically sealed MIL-DTL-38999 connectors, and highly efficient thermal management scheme, the rugged DuraHPC 5-1 is designed to operate over extended temperature ranges and comply with MIL-STD-810G environmental and MIL-STD-461F EMI/EMC conditions. The DuraHPC 5-1s CPU subsystem chassis has a 1U 19 rack-mount form factor and comes ready to connect to an external chiller/heat exchanger to support operating temperatures of up to -40C to +85 C (-40F to +185F). To maximize computational performance in space-constrained applications, the units internal electronics are tightly coupled to an aluminum cooling plate that features sealed micro-channels and aerospace-grade inflow/outflow connectors to circulate water and efficiently extract heat from the unit. When mated with its companion liquid cooling subsystem, the system measures 2U in height, is completely standalone and self-contained for use in demanding operation conditions.

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