DuraHPC 5-1

Rugged High Performance Embedded Computing Subsystem

The DuraHPC 5-1 is a field-deployable, rugged High Performance Embedded Computer (HPEC) designed for computationally intensive processing requirements in extreme military, aerospace, and industrial applications.


• Field Deployable 167 Gflop HPC
• Rugged HPC Cluster Capable with Infiniband
/ 10 Gigabit Ethernet Interconnects
• Dual 6-Core Xeon Processors
• External / Integrated Liquid Cooling
• Sealed MIL-38999 Connectors
• 1U/2U Configurations


• Military, Aerospace, Industrial High Performance Computing
• Harsh Environment Data Intensive Processing
• Size, Weight & Power Constrained Mobile Data Center
• Command and Control (C2) On the Move Server
• C4ISR Situational Awareness / Technology Refresh
• Electronic Warfare / Ground Based and Airborne Radar Processor
• Embedded Training / Vetronics / Navtronics
• Video Surveillance / Homeland Security /Oil Reservoir Exploration
Delivering up to 167 GFlops of performance, the DuraHPC 5-1 features high- performance multi-core Intel Xeon server-class processors , an optional integrated liquid cooling subsystem, and a shock/vibration-resistant solid state disk (SSD). Fitted with an ingress-protected aluminium chassis, hermetically sealed MIL-DTL-38999 connectors, and highly efficient thermal management scheme, the rugged DuraHPC 5-1 is designed to operate over extended temperature ranges and comply with MIL-STD-810G environmental and MIL-STD-461F EMI/EMC conditions.

Leveraging the underlying high performance computing (HPC) blade architecture of the Aurora supercomputers but in a ruggedized and tightly integrated liquid-cooled chassis, the DuraHPC 5-1 is designed for data intensive tactical applications, including Intelligence, Surveillance, Reconnaissance (ISR), Digital Signal Processing (DSP), simulation/training, energy exploration, situational awareness, vehicle electronics and radar signal processing. All system processors are linked via Intel’s high bandwidth Quick Path Interconnect (QPI) with three channels of DDR3 memory connected to each CPU (up to 24GB DDR total). Each unit features low-latency Infiniband interconnectivity (or optional 10 Gigabit Ethernet) to support rugged parallel computing capabilities when more than one unit is connected together in a cluster.

The DuraHPC 5-1’s CPU subsystem chassis has a 1U 19” rack-mount form factor and comes ready to connect to an external chiller/heat exchanger to support operating temperatures of up to -40ΊC to +Ί65C (-40ΊF to +145ΊF). To maximize computational performance in space-constrained applications, the unit’s internal electronics are tightly coupled to an aluminum cooling plate that features sealed micro-channels and aerospace-grade inflow/outflow connectors to circulate water and efficiently extract heat from the unit. When mated with its companion liquid cooling subsystem, the system measures 2U in height is completely standalone and self-contained for use in climate controlled data center / labs or cold weather deployments.
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