The Adbc8025 board is based on the Intel® EP80579 SoC (System on Chip) which delivers a rich set of features making it possible to develop complex designs with minimum effort.
The great flexibility of this COM module allows a perfect match with the requirements of any project: connector type and position, form factor and similar other features can be easily arranged on the carrier board.
With the Adbc8025, devices such as network appliances, intelligent terminals and interactive platforms can be implemented very quickly; the time to market of even the most complex industrial and wireless applications is dramatically reduced.
Interfaces:
The Adbc8025 provides a large number of interfaces including 3 Gigabit Ethernet, 5 USB, 2 SATA and 2 CAN buses.
The Adbc8025 supports Linux and Windows® XP Embedded; fast application development is easy with the Adbc8025-CAR companion Evaluation Board that supplies standard connectors for all the interfaces of the module.

Architecture:

• COM Express

CPU:

• Intel® EP802579™ 1.066 GHz
• L1 cache: 32KB/32KB, L2 cache 256KB

Memory:

• SOR-DIMM 1 socket max 2GB with ECC support

Graphics:

• SXGA: 1280x1024

Ethernet:

• 3x 10/100/1000 BASE T

Serial SATA:

• Serial ATA 1.0a specification 1.5Gbps
• 2 ports

USB:

• 5 USB 2.0 ports

Serial Ports:

• Two RS232C ports

System Management Bus:

• PHILIPS PCA9544A

CAN:

• Two ports
• 2.0B specification

PCI Express:

• PCI Express Rev1.1 specification
• x4 lane

PCI bus:

• Width: 32 bit
• 33MHz
• VIO: 3.3V

LPC:

• LPC 1.1 specification

Expansion:

• PICMG COM.0 COM Express module base specification revision1.0
• Pin-out type: Type3 (440 pin)

Mechanical:

• Form factor: basic size
• Dimension: 125 x 95mm (4.92” x 3.74”)
• Width: 18mm (0.71”) (heat spreader included)
• Weight: 200g

Power Supply:

• +12V DC
• +5V SBY DC
• Battery power: 3V DC

Power Consmption:

• 22.8W typical

Operating Temperature:

• 0 to 55°C

Humidity:

• 0 to 90% non-condensing

Operating Systems Supported:

• Windows XP Embedded®, Linux®