Supercomputing performance for high density and low power
The CPU-570-10 is a dual socket soldered memory (up to 128 GB) board, with optional FPGA. The board can be configured in different ways:
High end high power configuration, it performs at 390 GFlop/s peak (340 TFlop/s sustained), 380 W
Low power configuration, within a power budget of less than 100 W
The board is optionally liquid cooled and can be used in a chassis that fits a standard 19rack and can also come ruggedized.
The board can be mounted on third party devices.
HIGHLIGHTS Extreme performance and high density
Liquid cooled and fanless
Best in the market for energy efficiency
Based on Intelฎ Xeon
Available also with air cooling
APPLICATIONS High performance computing (HPC)
Heavy computational loads
HPEC (high performance embedded computing)