Supercomputing performance for high density and low power

The CPU-570-10 is a dual socket soldered memory (up to 128 GB) board, with optional FPGA. The board can be configured in different ways:
• High end high power configuration, it performs at 390 GFlop/s peak (340 TFlop/s sustained), 380 W
• Low power configuration, within a power budget of less than 100 W

The board is optionally liquid cooled and can be used in a chassis that fits a standard 19’’rack and can also come ruggedized.
The board can be mounted on third party devices.
• Extreme performance and high density
• Liquid cooled and fanless
• Best in the market for energy efficiency
• Based on Intelฎ Xeon™
• Available also with air cooling
• High performance computing (HPC)
• Parallel computing
• Heavy computational loads
• Simulation
• Signal processing
• HPEC (high performance embedded computing)

Privacy   Legal Notice   Cookies Policy   ฉ EUROTECH S.p.A. 2015 P.IVA: IT01791330309

This site uses technical or similar cookies and third parties profiling cookies in aggregate form to improve your navigation experience and the use of the site. If you want to know more or opt out of some cookies consult our cookies extended policy. By closing this banner or continuing the navigation you are agreeing to our use of cookies.